SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Japan announces $3.9 billion in subsidies to Rapidus
  • 0

Japan announces $3.9 billion in subsidies to Rapidus

SemiMediaEdit
April 4, 2024

April 4, 2024 /SemiMedia/ -- According to reports, Japan has approved subsidies of up to 590 billion yen ($3.9 billion) to local chip company Rapidus to invest more in semiconductor manufacturing to catch up with global leaders.

Japan's Ministry of Economy, Trade and Industry said the additional funds will help Rapidus purchase chip manufacturing equipment and develop advanced back-end chip manufacturing processes. The next-generation semiconductors being developed by Rapidus are the most important technologies that will determine the future of Japan's industrial and economic growth. This fiscal year is extremely important for Rapidus.

The 19-month-old startup has so far secured billions of dollars in public funding to mass-produce chips in Hokkaido and compete with leading TSMC and Samsung.

The $3.9 billion in funding is part of about 4 trillion yen that Japan has set aside over the past three years to restore Japan's previous chip manufacturing capabilities.

Related

electronic components news Electronic components supplier Electronic parts supplier
KYOCERA AVX launches new 0201 fuse with industry’s lowest current rating
Previous
Samsung establishes new HBM improvement team
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator