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Home › Manufacturer › Qorvo released new chips which furtherly expand its leadership in 5G
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Qorvo released new chips which furtherly expand its leadership in 5G

SemiMediaEdit
June 14, 2018

Qorvo recently announced five new power amplifiers and front-end modules, QPA4501, QPA3506, QPB9329, QPB9319 and QPA9120, these products expand its RF portfolio of MIMO and 5G base stations. These highly integrated, efficient small form factor modules are suitable for all frequency bands from 5GHz to 39GHz for 5G and 5G previous architectures.

The new 5G product also includes two Class 2 power amplifiers, two integrated front end modules (FEM) and a wideband driver amplifier, besides, Qorvo furtherly announced two other amplifiers, the QPF4005 and QPF4006, the industry's first GaN FEM for 39GHz.

By helping to define the 5G standard as a representative of 3GPP and through cooperation with wireless infrastructure manufacturers, network operators, chipset vendors, and smartphone manufacturers, Qorvo is making a comprehensive plan for 5G. So far, Qorvo has helped dozens of 5G field trials, including the demonstration of Qorvo's 28 GHz products supporting Samsung® 5G MIMO at the 2018 Winter Olympics.

Roger Hall, general manager of Qorvo's high-performance solutions, said: "With the application of our products in dozens of 5G field trials, Qorvo continues to be a major promoter of 5G, supporting the exponential growth of mobile data. Today's RF product portfolio expansion Provides customers with the widest range of 5G connectivity solutions below 6GHz and mmW 5G."

 

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