SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Qorvo released new chips which furtherly expand its leadership in 5G
  • 0

Qorvo released new chips which furtherly expand its leadership in 5G

SemiMediaEdit
June 14, 2018

Qorvo recently announced five new power amplifiers and front-end modules, QPA4501, QPA3506, QPB9329, QPB9319 and QPA9120, these products expand its RF portfolio of MIMO and 5G base stations. These highly integrated, efficient small form factor modules are suitable for all frequency bands from 5GHz to 39GHz for 5G and 5G previous architectures.

The new 5G product also includes two Class 2 power amplifiers, two integrated front end modules (FEM) and a wideband driver amplifier, besides, Qorvo furtherly announced two other amplifiers, the QPF4005 and QPF4006, the industry's first GaN FEM for 39GHz.

By helping to define the 5G standard as a representative of 3GPP and through cooperation with wireless infrastructure manufacturers, network operators, chipset vendors, and smartphone manufacturers, Qorvo is making a comprehensive plan for 5G. So far, Qorvo has helped dozens of 5G field trials, including the demonstration of Qorvo's 28 GHz products supporting Samsung® 5G MIMO at the 2018 Winter Olympics.

Roger Hall, general manager of Qorvo's high-performance solutions, said: "With the application of our products in dozens of 5G field trials, Qorvo continues to be a major promoter of 5G, supporting the exponential growth of mobile data. Today's RF product portfolio expansion Provides customers with the widest range of 5G connectivity solutions below 6GHz and mmW 5G."

 

Related

5G Qorvo
Nexperia introduced new superjunction MOSFETs
Previous
Avnet appoints the new president of the Americas’ electronic components division
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features

Renesas launches RA0L1 MCUs with ultra-low power and capacitive touch features

September 18, 2025
0
Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

Nexperia launches first 40-100 V automotive MLPAK MOSFETs for next-gen vehicle systems

September 16, 2025
0
Silicon Labs launches FG23L wireless SoC to expand sub-GHz IoT market

Silicon Labs launches FG23L wireless SoC to expand sub-GHz IoT market

September 15, 2025
0
Kioxia to commercialize AI SSDs by 2027 in collaboration with Nvidia

Kioxia to commercialize AI SSDs by 2027 in collaboration with Nvidia

September 12, 2025
0
2
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator