SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel plans to build two new fabs in the United States
  • 0

Intel plans to build two new fabs in the United States

SemiMediaEdit
October 3, 2023

October 3, 2023 /SemiMedia/ -- Intel recently stated that it plans to invest more than $20 billion to build two new cutting-edge chip factories in Ohio, USA.

Industry insiders pointed out that according to the United States’ Chip and Science Act, Intel’s investment will receive semiconductor subsidy funds from the U.S. government.

The U.S. Department of Commerce also recently stated that more than 470 companies have expressed their hope to obtain semiconductor subsidy funds from the U.S. government.

Related

electronic components news Electronic components supplier Electronic parts supplier Intel Intel Ohio
STMicroelectronics releases automotive PMIC integrating CAN FD and LIN to enable simpler car-body controllers
Previous
South Korea's semiconductor exports in September hit highest level since October last year
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

November 6, 2025
0
Nexperia B.V. reports updates on global operations and China supply chain

Nexperia B.V. reports updates on global operations and China supply chain

November 6, 2025
0
DDR memory shortages may persist until 2027, Winbond says

DDR memory shortages may persist until 2027, Winbond says

November 6, 2025
0
Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

Glass-based MEMS packaging gains momentum as Asia-Pacific maintains lead

November 5, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator