SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel to build semiconductor packaging and testing plant in Poland
  • 0

Intel to build semiconductor packaging and testing plant in Poland

SemiMediaEdit
June 19, 2023

Jun 19, 2023 /SemiMedia/ -- According to Bloomberg News, Intel announced on June 16 that it will invest $4.6 billion in western Poland to build a semiconductor packaging and testing plant. This is another investment by Intel in the EU region after Germany, which reflects the EU's intention to increase the scale of local chip production amidst geopolitical tensions.

In the context of the European Chips Act, Polish Prime Minister Mateusz Morawiecki has announced that about $4.9 billion will be allocated to the Intel Poland factory project.

"Through our investments in Poland and the rest of the EU, we are excited to play a key role in building more resilient supply chains," said Intel CEO Pat Gelsinger.

Related

Electronic components electronic components news Electronic components supplier Electronic parts supplier Intel Poland
SEMI: Global semiconductor materials market revenue hits record $73 billion in 2022
Previous
Infineon's new digital isolators offer robust high-voltage Isolation, best-in-class efficiency and noise immunity
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Omdia: Global Semiconductor Revenue Tops $425 Billion in Q2, Up Record 31.4% Sequentially

Omdia: Global Semiconductor Revenue Tops $425 Billion in Q2, Up Record 31.4% Sequentially

September 15, 2026
0
Murata to Discontinue Selected MLCC Part Numbers Across Nine Series, Final Orders Due March 2028

Murata to Discontinue Selected MLCC Part Numbers Across Nine Series, Final Orders Due March 2028

September 14, 2026
0
Top 10 Fabless IC Design Revenue Jumps 73% to $141.45 Billion in Q2 2026, NVIDIA Takes 64% Share

Top 10 Fabless IC Design Revenue Jumps 73% to $141.45 Billion in Q2 2026, NVIDIA Takes 64% Share

September 14, 2026
0
Renesas Announces Second 2026 Price Adjustment, New Pricing Takes Effect January 1, 2027

Renesas Announces Second 2026 Price Adjustment, New Pricing Takes Effect January 1, 2027

September 11, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator