SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › onsemi launches new 1200 V EliteSiC MOSFETs to improve efficiency in EV and energy infrastructure applications
  • 0

onsemi launches new 1200 V EliteSiC MOSFETs to improve efficiency in EV and energy infrastructure applications

SemiMediaEdit
May 10, 2023

May. 10, 2023 /SemiMedia/ -- onsemi recently introduced its latest generation of 1200 V EliteSiC silicon carbide (SiC) M3S devices, which enable power electronics designers to achieve best-in-class efficiency and lower system costs. The new portfolio includes EliteSiC MOSFETs and modules that facilitate higher switching speeds to support the growing number of 800 V electric vehicle (EV) on-board charger (OBC) and energy infrastructure applications, such as EV charging, solar and energy storage systems.

Also part of the portfolio, are new EliteSiC M3S devices in half-bridge power integrated modules (PIMs) with industry leading lowest Rds(on) in a standard F2 package. Targeting industrial applications, the modules are ideally suited for DC-AC, AC-DC and DC-DC high power conversion stages. They provide higher levels of integration with optimized direct bonded copper designs to enable balanced current sharing and thermal distribution between parallel switches. The PIMs are designed to deliver high power density in energy infrastructure, EV DC fast charging and uninterruptible power supplies (UPS).

“onsemi’s latest generation of automotive and industrial EliteSiC M3S products will allow designers to reduce their application footprint and system cooling requirements,” said Asif Jakwani, senior vice president and general manager of the Advanced Power Division, onsemi. “This helps designers to develop high power converters with higher levels of efficiency and increased power densities.”

The automotive-qualified 1200 V EliteSiC MOSFETs are tailored for high-power OBCs up to 22 kW and high voltage to low voltage DC-DC converters. M3S technology has been developed specifically for high-speed switching applications and has the best-in-class figure of merits for switching losses.

Related

electronic components news Electronic components supplier Electronic parts supplier onsemi
ROHM Begins Mass Production of 650V GaN HEMTs That Deliver Class-Leading Performance
Previous
Yole: Global semiconductor equipment revenue is expected to drop by 13% year-on-year in 2023
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Murata to raise EMI component prices on rising silver costs

Murata to raise EMI component prices on rising silver costs

March 20, 2026
0
Vishay launches space-grade common mode choke for GaN and SiC designs

Vishay launches space-grade common mode choke for GaN and SiC designs

March 20, 2026
0
Lattice to raise FPGA prices by 10% on rising backend costs

Lattice to raise FPGA prices by 10% on rising backend costs

March 20, 2026
0
TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

TDK-Lambda releases 60V ORing FET modules with low Rds(on) for redundant power

March 19, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • Electronic components distributor
  • NXP

SemiMediaEdit

Administrator