SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Diodes Inc. releases 20Gbps 2x2 switch for fast multiplexing/switching in automotive media and driver assistance systems
  • 0

Diodes Inc. releases 20Gbps 2x2 switch for fast multiplexing/switching in automotive media and driver assistance systems

SemiMediaEdit
March 22, 2023

Mar. 22, 2023 /SemiMedia/ -- Diodes Incorporated introduces a new differential switching switch to address the increase in automotive computing power and its accompanying high-speed interfaces. This four-channel differential exchange switch provides a performance-optimized multiplexing solution and is targeted for automotive infotainment, telematics, SATA 3.0, SAS 3.0, and ADAS systems.

The automotive-compliant PI3DBS16222Q enables 2x2 differential multiplexing at speeds of 20Gbps, and supports USB 3.2 Gen 2, PCI Express 4.0, and 10GBASE-KR standards. The device leverages a proprietary design technique, enhancing its dynamic electrical characteristics. This delivers low insertion-loss (-2.0dB at 10GHz typical) and crosstalk (-17dB at 10GHz typical) figures, ensuring high signal-integrity levels. In addition, the device attains a 10ps bit-to-bit skew, and a low return-loss.

The PI3DBS16222Q high-speed, multi-channel exchange switch from Diodes is AEC-Q100 Grade 2 qualified, manufactured in IATF 16949 certified facilities, and supports PPAP documentation. It is supplied in a compact 2.5mm x 4.5mm TQFN-30L (ZL30) package, and it is available at $2.50 in 3,500 piece quantities.

For more information, please visit https://www.diodes.com/part/PI3DBS16222Q/.

Related

DIODES electronic components news Electronic components supplier Electronic parts supplier PI3DBS16222Q
Tokyo Electronics to build a new semiconductor equipment factory in Japan
Previous
SEMI: Global fab equipment spending expected to recover in 2024
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Nexperia China resumes major operations after brief disruption by Nexperia B.V.

Nexperia China resumes major operations after brief disruption by Nexperia B.V.

March 6, 2026
0
TI to raise chip prices from April, supply chain says

TI to raise chip prices from April, supply chain says

March 6, 2026
0
South Korea warns Middle East tensions could disrupt chip material supply

South Korea warns Middle East tensions could disrupt chip material supply

March 6, 2026
0
Infineon launches USB-C PD MCU with integrated 55V controller for Li-ion charging

Infineon launches USB-C PD MCU with integrated 55V controller for Li-ion charging

March 5, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator