SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASE Q4 capacity utilization rate is said to drop to 70%-80%
  • 0

ASE Q4 capacity utilization rate is said to drop to 70%-80%

SemiMediaEdit
September 28, 2022

According to semiconductor industry sources, ASE's capacity utilization rate will decline slightly in the fourth quarter of this year.

Sources pointed to slow demand for wire bonding and other back-ends for consumer ICs due to inventory adjustments across the consumer electronics industry supply chain.

"The slowdown in consumer electronics demand not only affects second-tier back-end companies, but also leading companies such as ASE. The utilization rate of ASE's main back-end factory in Kaohsiung will drop to between 70%-80% in the fourth quarter of this year." said the source.

ASE has previously said it is too early to comment on the general environment and potential shift in market demand next year.

Related

electronic components news
DRAM is not expected to stop falling until Q3 next year
Previous
TrendForce: Quarterly growth of the top ten foundries dropped to 3.9%
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon launches AIROC UWB TSL100 for precise positioning and secure access

Infineon launches AIROC UWB TSL100 for precise positioning and secure access

June 30, 2026
0
SK hynix plans 1,100 trillion won investment to expand AI memory production

SK hynix plans 1,100 trillion won investment to expand AI memory production

June 30, 2026
0
Lenovo warns memory and storage shortages may not ease soon

Lenovo warns memory and storage shortages may not ease soon

June 30, 2026
0
Supply chain sources say TSMC and Winbond are working on WoW memory stacking for AI chips

Supply chain sources say TSMC and Winbond are working on WoW memory stacking for AI chips

June 29, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic components distributor
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator