SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASE Q4 capacity utilization rate is said to drop to 70%-80%
  • 0

ASE Q4 capacity utilization rate is said to drop to 70%-80%

SemiMediaEdit
September 28, 2022

According to semiconductor industry sources, ASE's capacity utilization rate will decline slightly in the fourth quarter of this year.

Sources pointed to slow demand for wire bonding and other back-ends for consumer ICs due to inventory adjustments across the consumer electronics industry supply chain.

"The slowdown in consumer electronics demand not only affects second-tier back-end companies, but also leading companies such as ASE. The utilization rate of ASE's main back-end factory in Kaohsiung will drop to between 70%-80% in the fourth quarter of this year." said the source.

ASE has previously said it is too early to comment on the general environment and potential shift in market demand next year.

Related

electronic components news
DRAM is not expected to stop falling until Q3 next year
Previous
TrendForce: Quarterly growth of the top ten foundries dropped to 3.9%
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron to phase out DDR4 as DRAM prices spike amid supply shift

Micron to phase out DDR4 as DRAM prices spike amid supply shift

June 16, 2025
0
Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

Diodes debuts 64GT/s PCIe 6.0 ReDriver targeting AI servers and HPC systems

June 16, 2025
0
Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator