UMC announced yesterday that its Japanese subsidiary USJC will cooperate with DENSO in the manufacture of automotive power semiconductors and will build an IGBT production line for DENSO.

DENSO will provide its system-oriented IGBT components and process technology, while USJC will provide 12-inch wafer fab manufacturing capabilities. It is expected to achieve mass production of IGBT processes on 12-inch wafers in the first half of 2023.

UMC said that this is a major project of UMC, which will expand its importance and influence in the field of automotive electronics. With a strong portfolio of advanced specialty processes and fabs in different regions, UMC is well-positioned to meet the needs of the automotive sector, including advanced driver assistance systems, infotainment, connectivity and powertrains.

"DENSO is delighted to be one of the first companies in Japan to start mass production of IGBTs on 12-inch wafers. Semiconductors are becoming increasingly important in the automotive industry as mobility technologies develop, including autonomous driving and electrification. Through this cooperation, we have contributed to the stable supply of power semiconductors and the electrification of vehicles," said Koji Arima, President and CEO of DENSO.