Infineon Technologies AG introduces the automotive qualified EasyPACK™ 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A rms. With its featured specs, the module is optimized for inverter applications in hybrid and electric vehicles.

Over the past ten years, Infineon has sold more than 50 million EasyPACK modules with various chipsets for a wide range of industrial and automotive applications. With the introduction of the EDT2 (Electric Drive Train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters. The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip ensures significantly lower losses than current products on the market and even outperforms Infineon's previous chip generation by 20 percent.

Another unique feature of the EasyPACK is the plug-and-play approach, which simplifies module integration. In addition, compared to classic through-hole discrete packages as well as the HybridPACK™ 1, soldering of the pins is no longer required. Infineon's PressFIT contact technology enables a reduction in mounting time. Thanks to the package size, three EasyPACK 2Bs require 30 percent less surface area than a HybridPACK 1. For this reason they offer not only a very compact but also a cost-effective design. Furthermore, the EasyPACK 2B EDT2 is fully qualified to the AQG324 standard.

The new EasyPACK 2B EDT2 module FF300R08W2P2_B11A will be available starting in October 2021. Further information is available at