SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Intel's 2 new fabs break ground in the U.S.
  • 0

Intel's 2 new fabs break ground in the U.S.

SemiMediaEdit
September 27, 2021

On September 24, Intel broke ground on two chip fabs in Arizona, USA, to strengthen its competitiveness in the global foundry industry.

The new factories will be named Fab 52 and Fab 62 and will add to Intel’s existing facilities in its Ocotillo campus in Chandler, Arizona, which will house a total of 6 fabs.

Intel CEO Pat Gelsinger said the company will spend 20 billion US dollars to build the two fabs.

The two new factories will not only be used to produce Intel products, but will also provide foundry services for external customers, and they are expected to be fully operational in 2024. The two new factories will directly compete with TSMC, which started building a $12 billion fab in Arizona in June.

“Semiconductors are a hot topic these days and we face a global shortage that is causing chips to halt and slow the production of many other areas of the economy,” Gelsinger said during the groundbreaking event. “We are doing our part, and today’s announcement shows that we are working hard to overcome the shortage.”

Related

electronic components news Intel new fabs
ASE suspended production at Kunshan factory due to power restriction
Previous
ST releases highly integrated smart high-side drivers for automotive applications
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron’s HBM4 delay threatens its position in the next AI memory cycle

Micron’s HBM4 delay threatens its position in the next AI memory cycle

November 7, 2025
0
Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift

Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift

November 7, 2025
0
SEMI says AI-driven demand supports 12-inch wafer expansion in Q3

SEMI says AI-driven demand supports 12-inch wafer expansion in Q3

November 7, 2025
0
Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

Infineon TLE994x/TLE995x SoC targets small automotive BLDC and BDC motors

November 6, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator