MarketWatch

TI to receive $4.6 billion in CHIPS Act support

TI to receive $4.6 billion in CHIPS Act support

August 20, 2024
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Samsung to begin HBM4 tape-out by year-end, production expected late 2026

Samsung to begin HBM4 tape-out by year-end, production expected late 2026

August 20, 2024
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ESMC's first wafer fab will break ground on August 20

ESMC's first wafer fab will break ground on August 20

August 19, 2024
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AI Shifts to Edge: Smartphones and PCs See Market Boom

AI Shifts to Edge: Smartphones and PCs See Market Boom

August 16, 2024
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Shin-Etsu and SUMCO report decline in silicon wafer demand, slow market recovery

Shin-Etsu and SUMCO report decline in silicon wafer demand, slow market recovery

August 15, 2024
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33% of European auto chip revenue from China, report says

33% of European auto chip revenue from China, report says

August 14, 2024
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Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery

Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery

August 14, 2024
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Infineon releases high-Performance CIPOS™ Maxi Intelligent Power Module for industrial motor drives up to 4 kW

Infineon releases high-Performance CIPOS™ Maxi Intelligent Power Module for industrial motor drives up to 4 kW

August 13, 2024
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ASE acquires new plant to expand advanced packaging capacity

ASE acquires new plant to expand advanced packaging capacity

August 13, 2024
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Samsung to produce 1γ DRAM next year, report says

Samsung to produce 1γ DRAM next year, report says

August 13, 2024
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