SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › ASE acquires new plant to expand advanced packaging capacity
  • 0

ASE acquires new plant to expand advanced packaging capacity

SemiMediaEdit
August 13, 2024

August 13, 2024 /SemiMedia/ -- On August 9, ASE announced that it would spend NT$5.263 billion (approximately $162 million) to purchase the K18 plant owned by Hung Ching Development & Construction Co. Ltd. to meet the company's future demand for expanding advanced packaging production capacity.

The K18 plant is located in Kaohsiung City, with a total construction area of approximately 109,089 square meters. The plant was originally the K13 plant built by ASE Semiconductor in 2020 under a cooperative development contract signed with Hung Ching on a joint construction principle.

ASE purchased the K18 plant mainly to set up production lines for wafer bump packaging and flip-chip packaging processes. In addition to expanding the production capacity of advanced packaging, it aims to enhance the performance of ASE's unified packaging and testing services in the first park with the best production capacity configuration, and continue to strengthen the company's overall development.

Industry insiders said that ASE exercised its right of first refusal to purchase the plant this time to facilitate the future capacity expansion needs of the Kaohsiung plant.

Related

ASE ASE K18 electronic components news Electronic components supplier Electronic parts supplier
Samsung to produce 1γ DRAM next year, report says
Previous
Infineon releases high-Performance CIPOS™ Maxi Intelligent Power Module for industrial motor drives up to 4 kW
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Mouser Electronics expands to the Philippines with local customer service center
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
ST releases price increase notice

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

Micron raises U.S. investment to $200 billion, boosts HBM and manufacturing plans

June 13, 2025
0
Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

Murata launches world’s first resin-molded thermistor with wire-bonding for compact EV power modules

June 13, 2025
0
Micron to build semiconductor SEZ in India under $1.6 billion investment plan

Micron to build semiconductor SEZ in India under $1.6 billion investment plan

June 12, 2025
0
Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

Wolfspeed trims 73 jobs in North Carolina amid weak SiC chip demand

June 12, 2025
0
Copyright © 2017-2025 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator