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TI announces award agreement for CHIPS and Science Act funding
EU approves €1.3 billion subsidy to support Silicon Box's panel-level advanced packaging plant in Italy
Rapidus receives Japan's first EUV machine, targets 2nm production by 2027
Vishay releases precision thin film MELF resistors to reduce component counts, save space, and lower costs
GlobalWafers secures $406 million subsidy under US CHIPS Act
Infineon and EVE Energy partner to advance next-gen battery management systems
NXP partners with bitsensing for radar technology
China's IC output rises 8.7% year-on-year in November
Angstrom-T declares bankruptcy amid financial crisis
NXP announces acquisition of Aviva Links
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