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TI breaks ground on new 300mm wafer fab in Sherman, Texas
NXP plans to expand chip fab in Texas
Infineon releases dual-channel DC-DC controller for full LED headlamps without a microcontroller
Microchip: Chip delivery impacted by epidemic prevention and control measures in Shanghai
Nexperia expands portfolio of clip-bonded FlatPower packaged diodes with new automotive CFP2-HP device
Renesas announces investment of 90 billion yen to increase power semiconductor capacity
ST releases single-channel load switch for high startup current applications
Gartner: Chip supply could see excess capacity in 2023
onsemi releases high-efficiency USB power delivery solution
Infineon: Producing chips in multiple locations facilitates the resilience and long-term growth of the semiconductor supply chain.
Taiyo Yuden plans to expand MLCC production by 15% this year
Okmetic to build new fab in Finland for SOI wafers
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# electronic components news #
# Electronic component news #
# Infineon #
# Renesas #
# NXP #
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