SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Vishay's new TMBS® rectifiers in low profile SMP package to increase power density and efficiency
  • 0

Vishay's new TMBS® rectifiers in low profile SMP package to increase power density and efficiency

SemiMediaEdit
January 27, 2020

Vishay Intertechnology, Inc. expanded its offering of surface-mount TMBS® Trench MOS Barrier Schottky rectifiers with 16 new 2 A and 3 A devices in the eSMP® series low profile SMP (DO-220AA) package. The Vishay General Semiconductor rectifiers feature a wide range of reverse voltages from 45 V to 200 V, while their 3 A rating is the industry’s highest for the SMP package to increase power density.

With their forward voltage drop down to 0.36 V for 2 A and 0.37 V for 3 A devices, the rectifiers released today reduce power loss and improve efficiency in high frequency inverters, DC/DC converters, and freewheeling and polarity protection diodes for commercial and industrial applications. The devices are also available in AEC-Q101 qualified versions for automotive applications.

The new rectifiers feature a maximum operating junction temperature up to +175 °C and an MSL moisture sensitivity level of 1, per J-STD-020, LF maximum peak of +260 °C. The devices are RoHS-compliant and halogen-free.

Samples and production quantities of the new TMBS rectifiers are available now, with lead times of eight weeks for larger orders.

For the selection of this series of products, please visit: http://www.vishay.com/docs/48626/48626.pdf

Related

electronic components news TMBS rectifier Vishay rectifier
Diodes Incorporated launches PCIe 3.0/SATA3 Combo ReDriver Provides linear equalization with low-power operation
Previous
Texas Instruments | Connect: A guide to wireless connectivity technology
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay Launches XFD11KxxCA Bidirectional TVS With 11 kW-Class Pulse Capability and Up to 207.1 A Peak Current

Vishay Launches XFD11KxxCA Bidirectional TVS With 11 kW-Class Pulse Capability and Up to 207.1 A Peak Current

September 11, 2026
0
Infineon Launches TDA235E5 and TDA235E0 With 300 A Peak Current and Over 2 A/mm² Power Density

Infineon Launches TDA235E5 and TDA235E0 With 300 A Peak Current and Over 2 A/mm² Power Density

September 8, 2026
0
Vishay Launches CHEP Thin Film Resistors With Up to 2.8 W Power and 50 GHz Operation

Vishay Launches CHEP Thin Film Resistors With Up to 2.8 W Power and 50 GHz Operation

September 7, 2026
0
Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

September 3, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator