October 9, 2026 / SemiMedia / — Vishay Intertechnology has introduced the Vishay Sfernice D2TO35S, an Automotive Grade thick film power resistor with top-side cooling that delivers 35W power dissipation at 25°C in a surface-mount TO-263 (D²PAK) package.

Rather than relying primarily on the PCB to remove heat, the D2TO35S transfers thermal energy directly from the top of the package to a heatsink. When paired with an appropriate heatsink, Vishay said the device can provide up to nine times greater power dissipation than standard PCB-mounted solutions.

The architecture allows designers to handle more power within the same board footprint or maintain existing power levels in a smaller design. Moving heat away from the PCB can also reduce board temperatures and thermal stress on surrounding components, improving system reliability in high-power automotive applications.

The D2TO35S uses a non-inductive design for improved performance under fast transient conditions. It offers resistance values from 4.7Ω to 550kΩ, tolerances down to ±1%, thermal resistance of 4.28°C/W and temperature coefficient values down to ±150ppm/°C.

The AEC-Q200-qualified resistor operates across a temperature range of -55°C to +175°C. It is RoHS compliant and supports solder reflow at 270°C for 10 seconds.

Samples and production quantities of the D2TO35S are available now, with standard lead times of approximately 14 weeks.