SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TDK releases compact transformers with EP 6 cores for ultrasonic applications
  • 0

TDK releases compact transformers with EP 6 cores for ultrasonic applications

SemiMediaEdit
January 26, 2022

TDK Corporation has introduced the new B78416A series of compact EPCOS transformers with EP 6 cores for ultrasonic applications. The series comprises five types with transformation ratios between 1:1:8.42 and 1:1:15. Depending on the type, the new SMD-version transformers offer inductance values between 3 mH and 5 mH and are suitable for frequencies between 52 kHz and 300 kHz. The components are compliant with AEC-Q200, feature highly compact dimensions of just 9.0 x 7.6 x 7.1 mm and are magnetically shielded for better interference suppression. The permissible temperature range lies between -40 °C and +125 °C.

The transformers serve optimal impedance matching between the driver IC and the ultrasonic transmitter or receiver in ultrasonic applications. Typical applications include parking aids, industrial robots, drones, logistics robots, automated guided vehicles (AGVs) and systems for fill level measurement.

Main fields of application

  • Parking aids
  • Industrial robots
  • Drones and logistics robots
  • Systems for fill level measurement

Main features and benefits

  • Highly compact dimensions of just 9.0 x 7.6 x 7.1 mm
  • Working frequencies of between 52 kHz and 300 kHz
  • Permissible temperature range of -40 °C to +125 °C
  • Qualified to AEC-Q200

For more information, please click B78416A.

Related

B78416A compact transformers electronic components news TDK
Omron issues price increase notice
Previous
Intel fab 34 to start production in 2023
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon launches RIC70115 rad-hard GaN gate driver for space systems

Infineon launches RIC70115 rad-hard GaN gate driver for space systems

July 20, 2026
0
ROHM adds DFN8080 and TOLL packages to 600V Super Junction MOSFETs

ROHM adds DFN8080 and TOLL packages to 600V Super Junction MOSFETs

July 16, 2026
0
Vishay introduces automotive 1 MBd high speed optocoupler

Vishay introduces automotive 1 MBd high speed optocoupler

July 15, 2026
0
PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand

July 15, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator