SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › TAIYO YUDEN Commercializes MLCCs with a Maximum Operating Temperature of 150°C
  • 0

TAIYO YUDEN Commercializes MLCCs with a Maximum Operating Temperature of 150°C

SemiMediaEdit
June 15, 2020

TAIYO YUDEN CO., LTD. announced the commercialization of MLCCs with an increased maximum operating temperature of 150°C. This product lineup is compatible with AEC-Q200, a reliability test qualification standard for automotive passive components.

Taiyo Yuden has sophisticated various types of elemental technologies to improve the temperature characteristics of X7R (operating temperature range: -55 to 125°C) in the conventional products to X8L (-55 to 150°C). These products are available in a wide assortment of dimensions, from the 1005 size (1.0 × 0.5 mm) to the 3225 size (3.2 × 2.5 mm).

TAIYO YUDEN Commercializes MLCCs with a Maximum Operating Temperature of 150°C-SemiMedia

The target applications for these MLCCs are decoupling or anti-noise components of automotive powertrains, such as engines and transmissions.

Production of the multilayer ceramic capacitors commenced at the TAIYO YUDEN's Tamamura Plant (Tamamura-machi, Sawa-gun, Gunma Prefecture, Japan), KOREA KYONG NAM TAIYO YUDEN CO., LTD. (Sacheon-si, Gyeongsangnam-do, Korea) starting from May 2020.

 

 

Related

150 degree MLCC electronic components news Taiyo Yuden MLCC
Mitsubishi Electric acquires part of Sharp's Fukuyama semiconductor plant
Previous
Nokia and Broadcom cooperate to develop 5G chips
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator