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ST releases 45W and 150W MasterGaN devices for high-efficiency power conversion
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SEMI: North American semiconductor equipment shipments in July increased 49.8% year-on-year
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Packaging and testing factory in mainland China are strengthening QFN packaging capabilities for automotive chips
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ADI and Maxim announce China antitrust clearance for combination
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GlobalFoundries: Global chip output must double in 10 years to address shortages
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IC Insights: Samsung surpasses Intel to become world’s largest semiconductor supplier in 2Q21
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Vishay launches AEC-Q200 certified ultra-fast-acting thin-film chip fuse for automotive applications
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Microchip's new I2C Serial EEPROM introduces 3.4MHz high-speed mode operation, software write protection and factory programmed serial numbers
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Cree and ST expand 150mm SiC wafer supply agreement
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IHS:Global light vehicle production hit by chip shortage is expected to continue until 2022
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