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Micron delays New York DRAM fab startup, shifts focus to Idaho
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NXP backs Israel’s RAAAM to boost on-chip memory innovation
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Renesas unveils RRG5006x Gen6 DDR5 RCD to boost data center memory performance
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TSMC starts foundation work for 1.4nm fab in Taichung, eyes 2028 mass production
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SIA says Q3 global chip sales rose 15.8% as Asia and Americas drive recovery
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Infineon opens dedicated UWB Application Lab in Austria to advance automotive and industrial positioning
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China move to resume Nexperia chip exports signals breakthrough for Europe carmakers
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Micron’s HBM4 delay threatens its position in the next AI memory cycle
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Kaga Electronics expands Thai PCBA capacity to capture China manufacturing shift
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SEMI says AI-driven demand supports 12-inch wafer expansion in Q3
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