SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › IonQ to acquire US chip foundry SkyWater in $1.8 bln deal
  • 0

IonQ to acquire US chip foundry SkyWater in $1.8 bln deal

SemiMediaEdit
January 29, 2026

January 29, 2026 /SemiMedia/ — Quantum computing company IonQ said it has agreed to acquire US-based chip manufacturer SkyWater Technology in a cash-and-stock transaction valuing the foundry at about $1.8 billion.

IonQ chief executive Niccolo de Masi said the acquisition would give the company access to a large domestic semiconductor foundry, helping speed up technology development and improve its appeal to customers in sensitive sectors such as defence. He added that IonQ aims to expand its customer base beyond government agencies to large enterprise clients.

SkyWater positions itself as a pure-play US foundry, focusing on chip manufacturing rather than design, in contrast to overseas competitors. IonQ said SkyWater’s manufacturing capacity and engineering capabilities could support both near-term development and longer-term production needs.

Industry observers said the deal reflects growing strategic interest in US-based semiconductor manufacturing, as supply chain security and domestic production become more important for advanced computing technologies.

Related

Electronic components distributor electronic components news IonQ acquisition quantum computing hardware semiconductor foundry SkyWater foundry US chip manufacturing
NXP launches UCODE X chip to support smaller RAIN RFID labels
Previous
SK hynix said to supply HBM3E exclusively for Microsoft’s Maia 200 AI chip
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator