SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › STMicroelectronics becomes first GSMA certified chip manufacturer
  • 0

STMicroelectronics becomes first GSMA certified chip manufacturer

SemiMediaEdit
July 2, 2018

STMicroelectronics has recently passed GSMA certification, becoming the world's first GSMA-certified embedded SIM (eSIM) manufacturer. According to the GSMA's UICC Production Safety Certification Program (GSMA SAS), ST will produce eSIM chips based on existing certifications that comply with the GSMA security and reliability specifications.

The eSIM is customized with connection credentials, enabling smaller form factors, higher security and greater flexibility. Its chip-level, permanently embedded, and electronically reprogrammable features allow smart phones to save more space for additional functionality or battery capacity, while its size advantages allow it to be used in more applications. Examples include smart watches and Internet-based smart phones, Internet of Things (IoT) devices, including smart meters, remote sensors or gateways.

ST can now deliver a personalized eSIM built from the validated ST33 security microcontroller directly to the customer's production facility, ready to use at any time without further programming request. OEMs, mobile network operators and SIM operating system (OS) providers can save processing overhead and shorten time-to-market by simplifying the eSIM supply chain, thereby enjoying greater convenience, economy, and business efficiency.

Related

first GSMA certified chip manufacturer STMicroelectronics
Microchip announces two new MCUs
Previous
Apple broadens its partnership with Cirrus Logic
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
onsemi expects to produce 200mm SiC wafers by 2025
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Infineon PSC3M/P6 MCUs Combine Four-Motor Control With Post-Quantum Firmware Security

Infineon PSC3M/P6 MCUs Combine Four-Motor Control With Post-Quantum Firmware Security

October 20, 2026
0
Murata Completes New Vietnam Production Building to Expand Coil Component Capacity

Murata Completes New Vietnam Production Building to Expand Coil Component Capacity

October 12, 2026
0
Renesas Launches First 100V E-mode GaN FET Family for AI Data Centers and Robotics

Renesas Launches First 100V E-mode GaN FET Family for AI Data Centers and Robotics

October 10, 2026
0
Vishay Launches 35W Automotive D2TO35S Power Resistor With Up to 9× Higher Dissipation

Vishay Launches 35W Automotive D2TO35S Power Resistor With Up to 9× Higher Dissipation

October 9, 2026
0
2
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator