SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › ST launches new LoRaWAN sub-1GHz STM32 SiP module to simplify long-range IoT connectivity
  • 0

ST launches new LoRaWAN sub-1GHz STM32 SiP module to simplify long-range IoT connectivity

SemiMediaEdit
January 16, 2024

January 16, 2024 /SemiMedia/ -- STMicroelectronics has revealed a long-range, low-power IoT System-in-Package programmable module built with dual-core STM32WL55JC wireless system-on-chip (SoC), saving bill-of-materials costs and time to market for remote metering, monitoring, and smart-sensing devices – enabling simple, immediate and effective LPWAN wireless connectivity.

The STM32WL5MOC SiP comes in a LGA92 10mm x 10mm package and combines the SoC with frequency-controlled oscillators, an IC containing balun, filter, and matching network, a receive/transmit switch, and associated passives needed for system operation. Bringing these components together in the module enables users to accelerate RF design, save space, and simplify circuit-layout challenges, thus saving the time and cost of otherwise complex RF design investments with experienced teams or certifications.

This miniature SiP module enables data communication over an exceptionally long range while using very little power, allowing system-battery lifetime greater than 10 years. Operating in the 864MHz to 928MHz band, permitting license-free use in regions worldwide, the STM32WL5MOC comes pre-certified for connection to LoRaWAN and Sigfox networks. The open wireless subsystem supports multiple modulation schemes, including (G)FSK, (G)MSK, BPSK, in addition to LoRa® modulation, and is compatible with standard and proprietary protocols such as wM-Bus, Wi-Sun, Mioty, and others. Additionally, the RF output power is selectable up to 22dBm, as permitted in US and Asian territories, or 15dBm according to European regulations.

Leveraging the STM32WL55 SoC dual-core architecture with 256KB Flash and 64KB RAM on-chip, the module assures real-time performance of the user application. The SoC’s Arm® Cortex®-M4 core with DSP extensions and Cortex-M0+ both implement memory protection for enhanced security. The Cortex-M0+ has additional secure services including key management, secure firmware install and update, and secure sub-GHz MAC layer. An option with onboard STSAFE-A110 is also available to further strengthen end-to-end data and networking security.

The STM32WL5MOC is fully integrated in the STM32 development ecosystem and supported within the STM32CubeMX tool for project initialization and software development. The B-WL5M-SUBG1 wireless prototyping board is also available and contains a STM32WL5MOC module to facilitate evaluation and software integration. The USB-powered board is ready to use out of the box and is supplied with an antenna fitted.

The STM32WL5MOCH6TR modules are in production now and available from $9.09 web price for orders of 10,000 pieces. For more information, please visit https://estore.st.com/en/stm32wl5moch6tr-cpn.html?ecmp=tt36803_gl_enews_jan2024.

Related

electronic components news Electronic components supplier Electronic parts supplier STM32WL5MOC STMicroelectronics
TDK released SmartedGeml™ to run ultra-low power machine learning models on a 6-axis IMU
Previous
South Korea plans to build the world’s largest semiconductor cluster
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

September 3, 2026
0
NVIDIA Invests $3.5 Billion in MediaTek, Expands AI Partnership Across Data Centers, PCs and Automotive

NVIDIA Invests $3.5 Billion in MediaTek, Expands AI Partnership Across Data Centers, PCs and Automotive

September 1, 2026
0
CXMT Begins Small-Scale HBM3E Production, Targets 350,000 DRAM Wafers per Month by Year-End

CXMT Begins Small-Scale HBM3E Production, Targets 350,000 DRAM Wafers per Month by Year-End

September 1, 2026
0
Vishay Launches 17-Device IFBT Flyback Transformer Series for 26 V to 72 V Input and Up to 30 W Designs

Vishay Launches 17-Device IFBT Flyback Transformer Series for 26 V to 72 V Input and Up to 30 W Designs

August 31, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator