SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Sony introduces new sensors
  • 0

Sony introduces new sensors

SemiMediaEdit
January 2, 2019

Recently, Satoshi Yoshihara, head of Sony's photosensitive components department, said that Sony expects to mass-produce the photosensitive elements supporting ToF 3D technology in the summer of 2019, which is expected to be applied to partners' products. At present, Sony has begun to provide external testing projects, allowing partners to make advance software adjustments on compatibility issues.

At present, Apple, Xiaomi and other mobile phone manufacturers have adopted Sony's sensor with structured light function, and Sony's ToF 3D sensor will also be widely used by these mobile phone manufacturers.

The ToF technology measures the depth and distance between the sensor and the object, and then uses the mobile phone processor to measure and can be applied to face unlocking and modeling on the mobile phone. This technology can greatly improve the speed of unlocking and 3D modeling, but also has a higher accuracy measurement.

When the iPhone X was released, Apple brought the structured light technology of the front camera to project the face through more than 30,000 invisible optics to achieve 3D modeling imaging. ToF has more than 300,000 information points, which is 10 times that of 3D structured light. At the same time, the maximum drawing distance of ToF 3D super-induction technology can reach 3 meters, which is 3 times that of 3D structured light.

Related

electronic components news new sensors SONY
ASIC design company Faraday strengthens cooperation with Samsung
Previous
China's semiconductor sales increased by 17% in November 2019, but may slow down in 2019
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay Launches 17-Device IFBT Flyback Transformer Series for 26 V to 72 V Input and Up to 30 W Designs

Vishay Launches 17-Device IFBT Flyback Transformer Series for 26 V to 72 V Input and Up to 30 W Designs

August 31, 2026
0
Vishay launches four automotive common mode chokes with DCR down to 0.4 mΩ

Vishay launches four automotive common mode chokes with DCR down to 0.4 mΩ

August 26, 2026
0
ROHM launches fourth-generation 650 V IGBTs with 7 µs short-circuit tolerance

ROHM launches fourth-generation 650 V IGBTs with 7 µs short-circuit tolerance

August 25, 2026
0
Vishay launches RPWA 650 thick film power resistors rated for 650 W

Vishay launches RPWA 650 thick film power resistors rated for 650 W

August 24, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator