SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Samsung announced mass production of 1TB eUFS2.1
  • 0

Samsung announced mass production of 1TB eUFS2.1

SemiMediaEdit
January 30, 2019

Today, Samsung Electronics announced that the 1TB eUFS2.1 has officially entered the mass production phase.

The product uses Samsung's fifth-generation V-NAND technology. In the same package size (11.5mm x 13.0mm), the 1TB eUFS solution combines 16 stacked 512Gb V-NAND flash memories with a newly developed proprietary flash controller, double the capacity of the previous 512GB version. The new eUFS speeds up to 1,000MB/s per second, with random reads and writes of 58,000 IOPS and 50,000 IOPS, a 38% increase over 512GB.

Samsung plans to expand its fifth-generation 512Gb V-NAND production at its Pyeongtaek facility in South Korea in the first half of 2019 to fully meet the strong demand of global mobile device manufacturers for 1TB eUFS.

Related

electronic components news Sumsung
WPG Group's revenue and profit reached a record high last year
Previous
NXP | Priority Support- helping you to get to market faster
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

September 3, 2026
0
NVIDIA Invests $3.5 Billion in MediaTek, Expands AI Partnership Across Data Centers, PCs and Automotive

NVIDIA Invests $3.5 Billion in MediaTek, Expands AI Partnership Across Data Centers, PCs and Automotive

September 1, 2026
0
CXMT Begins Small-Scale HBM3E Production, Targets 350,000 DRAM Wafers per Month by Year-End

CXMT Begins Small-Scale HBM3E Production, Targets 350,000 DRAM Wafers per Month by Year-End

September 1, 2026
0
Vishay Launches 17-Device IFBT Flyback Transformer Series for 26 V to 72 V Input and Up to 30 W Designs

Vishay Launches 17-Device IFBT Flyback Transformer Series for 26 V to 72 V Input and Up to 30 W Designs

August 31, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator