June 27, 2025 /SemiMedia/ — Semiconductor packaging firm Aptos Technology has filed for bankruptcy, with total liabilities reaching NT$1.058 billion, as prolonged losses and weakening memory demand continue to weigh on the company.

Established in 2006, Aptos specialized in packaging solutions for MicroSD and NAND Flash products, leveraging proprietary technologies to serve global clients such as Toshiba, Micron, and ADATA. Despite its early success, the company struggled in recent years due to heightened market competition and persistent weakness in consumer SSD and memory demand.

On June 13, shareholders approved a resolution to dissolve the company. Following a review of its financial condition, court-appointed liquidators determined that Aptos lacked sufficient assets to meet its obligations, prompting the formal bankruptcy filing.

While Aptos had attempted to shift toward System-in-Package (SiP) technologies to broaden its product portfolio, the efforts failed to reverse its downward trajectory.

Industry observers are closely watching the fallout, including how Aptos’s packaging capacity might be redistributed and what impact this may have on the regional OSAT supply chain.