SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Onsemi announces world's first TOLL-packaged SiC MOSFET with 60% smaller packaging, enhanced performance and lower losses
  • 0

Onsemi announces world's first TOLL-packaged SiC MOSFET with 60% smaller packaging, enhanced performance and lower losses

SemiMediaEdit
May 11, 2022

onsemi recently announced the world’s first TO-Leadless (TOLL) packaged silicon carbide (SiC) MOSFET at TBL045N065SC1 which is intended for demanding applications including switch-mode power supplies (SMPS), server and telecommunication power supplies, solar inverters, uninterruptible power supplies (UPS) and energy storage. The device is suitable for designs that are required to meet the most challenging efficiency standards including ErP and 80 PLUS Titanium.

The NTBL045N065SC1 has a VDSS rating of 650 V with a typical RDS(on) of just 33 mΩ and a maximum drain current (ID) of 73 A. Based upon wide bandgap (WBG) SiC technology, the device has a maximum operating temperature of 175°C and ultra-low gate charge (QG(tot) = 105 nC) that significantly reduces switching losses. Additionally, the TOLL package is MSL 1 (moisture sensitivity level 1) rated – and guaranteed – to ensure that failure rates in mass production are reduced.

In addition, onsemi offers automotive grade devices with TO-247 3 lead, 4 leads and D2PAK 7 leads packages. For more information, please visit https://www.onsemi.com/products/discrete-power-modules/silicon-carbide-sic/silicon-carbide-sic-mosfets/ntbl045n065sc1.

Related

electronic components news NTBL045N065SC1 onsemi
ST and SEMIKRON collaborate to integrate silicon-carbide Power technology into next-generation electric vehicle drives
Previous
Onsemi Shenzhen is said to have sold two years capacity
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
SEMI: Global semiconductor equipment sales are expected to hit a new record in 2024

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Vishay Launches CHEP Thin Film Resistors With Up to 2.8 W Power and 50 GHz Operation

Vishay Launches CHEP Thin Film Resistors With Up to 2.8 W Power and 50 GHz Operation

September 7, 2026
0
Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

Vishay Introduces Two Low-Profile Common Mode Chokes Rated Up to 30 A and 1500 VDC

September 3, 2026
0
NVIDIA Invests $3.5 Billion in MediaTek, Expands AI Partnership Across Data Centers, PCs and Automotive

NVIDIA Invests $3.5 Billion in MediaTek, Expands AI Partnership Across Data Centers, PCs and Automotive

September 1, 2026
0
CXMT Begins Small-Scale HBM3E Production, Targets 350,000 DRAM Wafers per Month by Year-End

CXMT Begins Small-Scale HBM3E Production, Targets 350,000 DRAM Wafers per Month by Year-End

September 1, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator