March 16, 2026 /SemiMedia/ — NXP Semiconductors introduced the i.MX 93W applications processor, adding a new device to its i.MX 93 family aimed at edge AI systems.

The new chip combines an AI neural processing unit and wireless connectivity in a single package. It supports Wi-Fi 6, Bluetooth Low Energy and 802.15.4, allowing device makers to reduce external components and simplify board design.

The processor uses a dual-core Arm Cortex-A55 CPU and includes an Arm Ethos NPU with performance of up to 1.8 eTOPS for machine-learning tasks at the edge.

NXP said the integration can replace up to about 60 discrete components, helping reduce board size and lowering system cost. The chip is designed for products such as smart building controllers, healthcare devices, industrial gateways and smart home hubs.

The device also includes the company’s EdgeLock Secure Enclave, which provides hardware-based security features such as secure boot, device authentication and secure software updates.

NXP said it will offer pre-certified reference designs with single- and dual-antenna options to help customers shorten development cycles and simplify wireless certification.

The i.MX 93W is expected to begin sampling in the second half of 2026. For more information, please visit NXP.com/iMX93W.