SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › KLA invests $138 million to expand semiconductor R&D and manufacturing in Wales
  • 0

KLA invests $138 million to expand semiconductor R&D and manufacturing in Wales

SemiMediaEdit
May 28, 2025

May 28, 2025 /SemiMedia/ — U.S. semiconductor equipment maker KLA has invested $138 million to expand its research and manufacturing operations in Newport, Wales, focusing on advanced packaging technologies.

The new facility, spanning 237,000 square feet, adds significant production and collaboration capacity. It includes a 25,000-square-foot R&D cleanroom, 35,000 square feet of manufacturing space, and a demonstration area dedicated to power devices, RF, MEMS, photonics, and advanced packaging tools. The expansion builds upon KLA’s acquisition of SPTS Technologies in 2019, a move that initially established its presence in the region.

The site will eventually accommodate up to 750 employees. “As demand for high-performance chips driven by AI and other technologies continues to rise, our expanded footprint and deep technical portfolio position us to meet those needs,” said Dan Collins, general manager of KLA’s Wales operations. “This investment reinforces our commitment to technology, talent development, and long-term partnerships in the region.”

Jo Stevens, Secretary of State for Wales, welcomed the expansion, noting the strategic importance of Wales’s compound semiconductor cluster. “The UK government recently allocated nearly £5 million to support semiconductor talent development. KLA’s investment strengthens our leadership in this critical and fast-growing sector,” she said.

Related

Advanced packaging compound semiconductors electronic components news Electronic components supplier Electronic parts supplier KLA MEMS technology R&D investment semiconductor equipment
Samsung considers foundry spinoff to resolve client concerns and address losses
Previous
Microchip unveils PolarFire Core to cut FPGA costs for power-efficient applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator