SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › KLA invests $138 million to expand semiconductor R&D and manufacturing in Wales
  • 0

KLA invests $138 million to expand semiconductor R&D and manufacturing in Wales

SemiMediaEdit
May 28, 2025

May 28, 2025 /SemiMedia/ — U.S. semiconductor equipment maker KLA has invested $138 million to expand its research and manufacturing operations in Newport, Wales, focusing on advanced packaging technologies.

The new facility, spanning 237,000 square feet, adds significant production and collaboration capacity. It includes a 25,000-square-foot R&D cleanroom, 35,000 square feet of manufacturing space, and a demonstration area dedicated to power devices, RF, MEMS, photonics, and advanced packaging tools. The expansion builds upon KLA’s acquisition of SPTS Technologies in 2019, a move that initially established its presence in the region.

The site will eventually accommodate up to 750 employees. “As demand for high-performance chips driven by AI and other technologies continues to rise, our expanded footprint and deep technical portfolio position us to meet those needs,” said Dan Collins, general manager of KLA’s Wales operations. “This investment reinforces our commitment to technology, talent development, and long-term partnerships in the region.”

Jo Stevens, Secretary of State for Wales, welcomed the expansion, noting the strategic importance of Wales’s compound semiconductor cluster. “The UK government recently allocated nearly £5 million to support semiconductor talent development. KLA’s investment strengthens our leadership in this critical and fast-growing sector,” she said.

Related

Advanced packaging compound semiconductors electronic components news Electronic components supplier Electronic parts supplier KLA MEMS technology R&D investment semiconductor equipment
Samsung considers foundry spinoff to resolve client concerns and address losses
Previous
Microchip unveils PolarFire Core to cut FPGA costs for power-efficient applications
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Fire broke out at AKM factory in Japan
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Micron secures AI vehicle memory deals with Qualcomm and auto suppliers

Micron secures AI vehicle memory deals with Qualcomm and auto suppliers

July 17, 2026
0
Powertech plans $400 million Broadcom PLP venture in Singapore

Powertech plans $400 million Broadcom PLP venture in Singapore

July 17, 2026
0
Mitsubishi Electric seeks September deal with Rohm and Toshiba on power chips

Mitsubishi Electric seeks September deal with Rohm and Toshiba on power chips

July 17, 2026
0
Montage, Renesas and Rambus raided in South Korea price-fixing probe

Montage, Renesas and Rambus raided in South Korea price-fixing probe

July 16, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Electronic components distributor
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator