June 8, 2026 /SemiMedia/ — Infineon Technologies said it will transfer semiconductor backend manufacturing operations from its Tijuana plant in Mexico to other production sites, marking the start of a phased withdrawal of manufacturing activities from the facility.

The company said wafer dicing, assembly and testing operations currently handled at the Tijuana site will be gradually moved elsewhere. Infineon added that customer product supply will not be affected during the transition.

The Tijuana plant was originally established in 1973 by International Rectifier. It became part of Infineon after the German chipmaker acquired International Rectifier in 2015.

Infineon did not disclose which sites will take over the production functions currently performed in Tijuana.

George Lee, head of backend operations at Infineon, said the restructuring of production activities at the Tijuana plant is part of the company’s ongoing effort to optimize its global manufacturing footprint.

Industry observers said the move reflects broader reassessment across the semiconductor industry as companies adjust backend capacity to improve efficiency, cost structure and supply chain flexibility.

Backend manufacturing, including wafer dicing, assembly and test, remains a key part of the semiconductor supply chain, particularly for automotive, industrial and power semiconductor products where reliability and delivery stability are critical.

Infineon also said it is considering the potential sale of the Tijuana facility, though no further details were disclosed.