September 8, 2026 / SemiMedia / — Infineon Technologies has introduced the TDA235E5 and TDA235E0 dual-phase smart power stages for next-generation AI accelerators and vertical power delivery modules, integrating OptiMOS 6 MOSFETs and a dual-phase driver IC in a compact 6 × 6 × 0.8 mm³ package.

The devices deliver power density exceeding 2 A/mm² and support up to 300 A peak current with a total design current of 120 A, targeting next-generation AI xPU accelerators as well as conventional server CPUs in data center systems.

Both lateral and vertical power delivery configurations are supported, giving system designers flexibility as advanced AI processor packages increasingly move toward vertical power architectures that shorten the power delivery path and support higher current density.

The TDA235E5 and TDA235E0 are also designed for efficient liquid-cooling integration, with optimized junction-to-top-side thermal performance. This is becoming increasingly important as processor socket power continues to rise beyond the practical limits of traditional air cooling.

When combined with Infineon's digital multiphase controllers, the devices can support scalable multi-rail power architectures for rapidly evolving AI server platforms.

The new power stages form part of Infineon's broader AI server power delivery portfolio, which covers the power chain from the grid interface to processor core rails using silicon, silicon carbide and gallium nitride technologies.

Engineering samples of the TDA235E5 and TDA235E0 are available now for customer evaluation.