SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Infineon Dresden was forced to suspend production due to power outages
  • 0

Infineon Dresden was forced to suspend production due to power outages

SemiMediaEdit
September 24, 2021

According to reports, Infineon Technologies was forced to halt manufacturing operations at its chip fab in Dresden, Germany, due to a 20-minute power outage in the capital of Saxony.

Jochen Hanebeck, COO of Infineon, confirmed the manufacturing interruption at the company’s chip fab in Dresden on Sept. 13, 2021.

“We had winter storms in Texas and Covid [constraints] at many sites. You would believe that eventually you have covered all statistical improbabilities but, on Monday, the power supply was down for twenty minutes. The emergency generators started up, but they can only keep up with the relevant systems.” said Jochen Hanebeck.

“Many facilities went into an emergency stop status, but now most of the facilities are up and running again. What the colleagues have to do now is to evaluate the work in progress, the semi-finished products. In one or two weeks, we will be able to say more to our customers. The impact will be less than in Austin.” he added.

Related

electronic components news Infineon Dresden
TAIYO YUDEN to build a new MLCC factory in Malaysia
Previous
SK Group plans to invest 700 billion won to expand SiC business
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator