SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Holy Stone announces expansion of MLCC factory
  • 0

Holy Stone announces expansion of MLCC factory

SemiMediaEdit
December 28, 2018

On the 27th, passive electronic component manufacturer Holy Stone announced that it will expand its new plant in Taoyuan, Taiwan, and the new plant is expected to be put into production in the second half of 2020. The total investment amount was not disclosed.

Holy Stone Chairman Jing-Rong Tang said: "The prospects for high-end passive electronic components products will be very good in the next 5 to 10 years. Holy Stone will continue to focus on high-end MLCC products, and we are optimistic about the future development."

Jing-Rong Tang added: "New applications including industry 4.0, 5G, automotive electronics, artificial intelligence, and Internet of Things will drive MLCC to high-end technology. At present, Holy Stone's MLCC products have entered the robotic automation control application."

Related

electronic components news expansion of MLCC factory Holy Stone
Infineon's acquisition of STMicroelectronics has progressed
Previous
ASIC design company Faraday strengthens cooperation with Samsung
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

TSMC may raise 3nm prices as AI chip demand strains advanced foundry capacity

June 1, 2026
0
ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator