May 26, 2026 /SemiMedia/ — GlobalWafers said its 12-inch square monocrystalline silicon wafers have entered small-volume validation and are scheduled for mass production in the fourth quarter of 2026 as AI-driven semiconductor demand continues to support the large-diameter wafer market.

Chairperson Doris Hsu said during the company’s shareholder meeting on May 25 that the square wafers measure 310 mm × 310 mm. Because the diagonal dimension approaches 18 inches, the process requires pulling 18-inch silicon ingots before converting them into square wafers. Production will take place in Taiwan.

Hsu said the project requires significant capital investment and that the company is accelerating cleanroom construction to support the new production line. Initial monthly capacity will remain relatively limited at several thousand wafers, with future expansion planned in modular stages depending on customer demand.

The company has also reserved additional cleanroom space to support future equipment expansion without requiring major facility reconstruction.

Industry observers said square silicon wafers could improve material utilization efficiency in advanced semiconductor manufacturing and packaging applications, particularly in AI processors, advanced packaging substrates and high-density computing systems.

Hsu noted that the semiconductor market in 2025 remained highly polarized, with strong demand tied to AI-related applications and advanced process technologies, while mature-node and legacy semiconductor markets faced weaker conditions.

However, she added that market conditions have started to improve in 2026. Following the Lunar New Year holiday earlier this year, demand for smaller wafer products began recovering, with some production lines reportedly returning to overtime operation.