SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › DRAM chip prices expected to rise, report says
  • 0

DRAM chip prices expected to rise, report says

SemiMediaEdit
September 20, 2023

September 20, 2023 /SemiMedia/ -- According to reports, as NAND wafer prices have increased since the third quarter due to production cuts, DRAM prices are also expected to rebound in the next quarter. However, as end market demand has not yet seen a significant recovery, the increase may not be too significant.

Sources said NAND wafer prices have gradually rebounded from the lows at the beginning of the third quarter, with increases of more than 10% so far. He said that the increase in NAND prices is also expected to create a favorable market environment for DRAM price increases. Memory module makers are paying close attention to the timing of a rebound in DRAM prices.

Sources pointed out that DDR5 memory module prices will rise further after rising by 5-10% in the past month, and the price of entry-level products will also rise by 3-5%. In addition, high-priced DDR5 products will face supply shortages and may lead the rally.

Related

electronic components news Electronic components supplier Electronic parts supplier NAND Flash NAND wafer price
Micron plans to set up more semiconductor units in India
Previous
SEMI: Global 200mm wafer capacity is expected to grow by 14% by 2026
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips

May 29, 2026
0
ST issues new price increase notice effective June 28

ST issues new price increase notice effective June 28

May 29, 2026
0
PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

PKC expands high-purity chlorine capacity by 50% to support Samsung’s advanced chip production

May 29, 2026
0
Samsung to invest $1.5 billion in Vietnam for first chip testing facility

Samsung to invest $1.5 billion in Vietnam for first chip testing facility

May 28, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Electronic components distributor
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP

SemiMediaEdit

Administrator