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Rapidus to build fully automated 2nm chip fab, promising 66% faster delivery
Infineon releases high-Performance CIPOS™ Maxi Intelligent Power Module for industrial motor drives up to 4 kW
ASE acquires new plant to expand advanced packaging capacity
Samsung to produce 1γ DRAM next year, report says
Polymatech acquires chip packaging and testing equipment company Nisene
Infineon starts producing chips at its largest SiC factory
onsemi expects to produce 200mm SiC wafers by 2025
GlobalWafers purchases land in Malaysia to prepare for future expansion
Infineon announces completion of sale of two packaging plants to ASE
Microchip releases high-performance PCIe® Gen 5 SSD controller family
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