August 12, 2024 /SemiMedia/ -- According to reports, Indian optoelectronic semiconductor supplier Polymatech announced the acquisition of Nisene, a US semiconductor equipment supplier specializing in packaging and testing. The move is part of Polymatech's broader strategy to build an integrated chip manufacturing business across multiple fields.

The report stated that Polymatech Electronics acquired Nisene Technology Group through Polymatech's Singapore subsidiary Artificial Electronics Intelligence Materials.

To further strengthen its business, Polymatech plans to invest up to $500 million in the U.S. The company will focus on producing advanced semiconductor materials such as silicon carbide (SiC) and sapphire wafers, as well as high-performance chips for computers and smartphones.

“This acquisition complements Polymatech’s cutting-edge product portfolio and facilitates the development of new product categories,” said Ryan Young, incoming CEO of Nisene.

Nisene and Polymatech believe that the former's expertise in silicon and SiC, combined with the latter's sapphire-based semiconductors, has led to unique multi-wafer technology. They claim that the merger could make Polymatech the only company in the world with such a broad semiconductor product portfolio.

“With 50 years of experience and expertise in the semiconductor industry, Nisene has seen the growth from nothing to something. Now as part of Polymatech, together we will create the next generation of better and more powerful semiconductors,” said Eswara Rao Nandam, CEO of Polymatech.

It is noted that Polymatech will continue to produce sapphire wafers using advanced technology provided by leading European equipment suppliers, which are expected to be put into use in its factory by the end of January 2025.