April 16, 2026 /SemiMedia/ — Analog Devices has started operations at a new backend manufacturing site in Chonburi, Thailand, expanding its local role beyond testing into wafer-level processing and chip-scale packaging.

The facility, which began operations in March, handles wafer-level work, CSP packaging and final IC testing. The company said Thailand plays a key role in its global manufacturing network, and the new site is expected to support more stable supply and faster delivery.

Analog Devices’ Thai unit, established in 2000, previously focused on testing services. With the addition of in-house packaging steps, the site now covers a broader backend process, improving integration between packaging and testing.

In Southeast Asia, the company also runs a packaging and test plant in General Trias, Philippines, and a test facility in Penang, Malaysia. The Thailand expansion adds more balance to its regional backend footprint.

For front-end production, Analog Devices mainly relies on its own fabs running on 200mm and smaller wafers in the United States and Ireland. For advanced 300mm nodes, the company continues to work with external foundry partners.