August 21, 2026 / SemiMedia / — Broadcom is discussing a new AI chip financing transaction with lenders that could support compute deployments for Anthropic and other companies, Reuters reported, citing Bloomberg News.

The proposed structure could include approximately $30 billion of junior debt and between $60 billion and $70 billion of senior secured debt. Broadcom would reportedly provide partial support for the senior portion, potentially bringing the total financing package close to $100 billion.

The terms remain under discussion, and the final size and structure could change. Apollo Global Management and Blackstone are reportedly in talks with Broadcom about participating in the transaction.

The debt is expected to be issued through a special-purpose vehicle that would finance AI computing equipment based on Broadcom’s custom XPUs and networking technologies and make the resulting capacity available to Anthropic and other customers.

The structure would resemble the AI XPV Platform launched by Broadcom, Apollo and Blackstone in June. That platform began with a $35 billion transaction supporting more than 1 gigawatt of additional compute capacity for Anthropic.

The AI XPV Platform aims to deploy more than 20 gigawatts of compute capacity for frontier AI laboratories, including Anthropic and OpenAI, using Broadcom custom silicon and networking solutions through 2028. The latest financing discussions could significantly expand the platform, although no final agreement has been announced.