SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Molex releases EdgeLock wire-to-signal card connector
  • 0

Molex releases EdgeLock wire-to-signal card connector

SemiMediaEdit
August 2, 2018

Molex introduces the EdgeLock wire-to-signal card connector to ensure a direct and robust pairing of conductive contacts on the edge of the printed circuit board. This 2.00 mm pitch edge-lock connector saves space and reduces assembly time.

Molex releases EdgeLock wire-to-signal card connector-SemiMedia

The EdgeLock wire-to-signal card connector eliminates the need to pair the connector assembly, reducing assembly costs. Anti-missing ribs on the connector housing prevent incorrect mating to the printed circuit board (PCB). It also supports a maximum current of 3.0 amps. The double cantilever crimp terminal design features raised contacts for higher normal force and long-term electrical reliability.

System rework is also very convenient because the EdgeLock system uses a mortise lock to quickly remove components from the printed circuit board. The redesigned PA46 material is a low halogen material ideal for high temperature environments and applications.

Molex product manager Myung Gyu Kim said: "The consumer electronics and appliance industries want a secure connector system, and EdgeLock meets this requirement. The EdgeLock connector replaces the typical solder joint and provides a solid connection through the center. The blocking function also saves space."

Related

Electronic component news Molex wire-to-signal card connector
Allegro and UMC signs a long-term cooperation agreement
Previous
Advancing real-time health monitoring with Maxim Integrated Technology
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
Microchip launches military-grade plastic TVS devices for aerospace use

Microchip launches military-grade plastic TVS devices for aerospace use

January 15, 2026
0
Vishay expands transmissive sensor lineup for industrial and telecom encoder designs

Vishay expands transmissive sensor lineup for industrial and telecom encoder designs

January 13, 2026
0
Infineon launches low-power Wi-Fi 7 tri-radio chip targeting IoT devices

Infineon launches low-power Wi-Fi 7 tri-radio chip targeting IoT devices

January 12, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator