SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Yageo announces acquisition of Heraeus' high-end temperature sensor division
  • 0

Yageo announces acquisition of Heraeus' high-end temperature sensor division

SemiMediaEdit
October 12, 2022

Yageo announced yesterday that it will acquire Heraeus Nexensos' high-end temperature sensor division in cash. The total transaction value is expected to be approximately 79.4 million euros (approximated $77.26 million), and the transaction will be completed in the first half of 2023.

Heraeus' temperature sensor division is headquartered in Hanau, Germany, and has two manufacturing sites in Germany and Malaysia. Products include wire sensors, SMD sensors, and PCB sensors.

As of 2021, 60% of Heraeus' temperature sensor business revenue comes from high-end markets such as North America and Europe, and 100% of revenue comes from industrial and automotive customers.

"In a world that is rapidly moving towards intelligence, sensors are an integral part of this transformation. For us, temperature sensors add more integrity to the existing Yageo and TOKIN sensor product portfolio. It will be the perfect product to push us further into the sensor market. The Heraeus Temperature Sensor Division has a series of products and customers that are highly complementary to Yageo, especially in the automotive and industrial sectors, and will be a key driver for future growth. " Said Pierre Chen, chairman of Yageo, said.

Related

electronic components news Yageo
Japanese semiconductor equipment maker's August revenue hits record high
Previous
Insider: TSMC considering building factory in Germany
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Rohm and Toshiba discuss combining power semiconductor operations

Rohm and Toshiba discuss combining power semiconductor operations

March 13, 2026
0
Top foundries post $46.3 bln revenue in Q4 2025 as TSMC keeps strong lead

Top foundries post $46.3 bln revenue in Q4 2025 as TSMC keeps strong lead

March 13, 2026
0
Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

Microchip launches LX4580 mixed-signal IC for aerospace and defense systems

March 13, 2026
0
Infineon expands MCU market lead to 23.2% share in 2025

Infineon expands MCU market lead to 23.2% share in 2025

March 12, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator