SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Reuters: Micron breaks ground on $15 billion chip factory, will announce another new factory
  • 0

Reuters: Micron breaks ground on $15 billion chip factory, will announce another new factory

SemiMediaEdit
September 14, 2022

Micron Technology on Monday broke ground on a $15 billion factory in Boise, Idaho, and said it would announce another new U.S. factory soon, according to Reuters.

"We are in the final stages of another high-volume manufacturing site that will be announced in the coming weeks," said Micron Technology CEO Sanjay Mehrotra.

The two factories will produce DRAM chips used in data centers, personal computers and other equipment. Once operational, the U.S. factory will account for 40% of Micron's global DRAM production, up from 10% now. The Boise plant will be operational in 2025.

Related

electronic components news Micron Boise Micron factory
Toshiba's MCU factory in Japan shuts down due to power outage
Previous
GlobalWafers to break ground on new Texas plant in November
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung memory price hike to Apple highlights tight LPDDR5X supply

Samsung memory price hike to Apple highlights tight LPDDR5X supply

February 27, 2026
0
Hanwha report sees memory surge in 2026 as HBM gains traction

Hanwha report sees memory surge in 2026 as HBM gains traction

February 27, 2026
0
Broadcom targets 1 million stacked AI chips shipped by 2027

Broadcom targets 1 million stacked AI chips shipped by 2027

February 27, 2026
0
SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator