SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › NXP launches AI Application Innovation Center in China
  • 0

NXP launches AI Application Innovation Center in China

SemiMediaEdit
May 24, 2021

According to local Chinese media reports, NXP Semiconductors China recently held the launching ceremony of its AI Application Innovation Center in Tianjin.

The innovation center has two parts. The first part is the artificial intelligence application demonstration base, which will focus on displaying more than 100 cutting-edge technologies and applications of NXP and its partners, covering smart cities, smart homes, smart travel, smart industries, etc. The second part is the artificial intelligence innovation practice base, which will empower partners to carry out localized innovation through technical training and leading R&D platforms.

"The establishment of the AI Application Innovation Center once again demonstrates NXP’s commitment to enabling customers to build smart devices through high-performance computing, extremely high energy efficiency, and safety. The center has more than 2,000 square meters of interactive engineering space, and we hope it It is not only a hub for collaboration with local ecological partners, but also a charity platform that can inspire social innovation," said Ron Martino, executive vice president and general manager of edge processing technology at NXP.

Related

AI Application Innovation Center electronic components news NXP
TSMC to increase MCU output by 60%
Previous
Renesas launches entry-level RZ/V2L Mpus with first class power efficiency and high-precision AI accelerator
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Lenovo raises PC prices as memory chip costs increase

Lenovo raises PC prices as memory chip costs increase

March 9, 2026
0
Nanya sees DRAM supply tightness lasting until 2028

Nanya sees DRAM supply tightness lasting until 2028

March 9, 2026
0
Tower Semiconductor says Israel fabs running normally amid security situation

Tower Semiconductor says Israel fabs running normally amid security situation

March 9, 2026
0
Nexperia China resumes major operations after brief disruption by Nexperia B.V.

Nexperia China resumes major operations after brief disruption by Nexperia B.V.

March 6, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator