SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Allegro releases sensor interface ICs offering high accuracy and output flexibility for resistive bridge pressure sensors
  • 0

Allegro releases sensor interface ICs offering high accuracy and output flexibility for resistive bridge pressure sensors

SemiMediaEdit
March 2, 2021

Allegro MicroSystems, Inc. recently introduced the A17700, an automotive-grade interface IC for resistive bridge pressure sensors featuring top-of-the-line signal conditioning algorithms.Built on decades of automotive sensor expertise, the A17700 delivers premium performance and increased system efficiency with flexible interface options – all in a small form factor.

Market-leading features:

  • Flexible compensation algorithms for accuracy over temperature and sensing bridge variation;
  • Precise pressure information delivery in low delay analog, PWM, or SENT outputs;
  • Automotive AEC-Q100 Grade 0 qualification and EMC robustness with minimized external components;
  • A suite of advanced integrated system diagnostics.

The A17700 is configurable for resistive bridge pressure sensors in a wide range of critical applications in today’s efficiently designed cars; from high-pressure systems like dynamic brake systems (DBS) in turbo and hybrid electric vehicles (HEV) or gasoline direct injection (GDI) to medium and low-pressure systems such as brake boosters, HVAC applications for electrified vehicles, and automatic transmission oil management.

With its best-in-class integrated polynomial algorithm, the A17700 interface sensor offers high accuracy over pressure and temperature through two-stage processing of a pressure signal.  This flexible compensation delivers high accuracy in resistive membranes requiring either high- or low-point characterization during assembly.

Striking a balance highly desired by system designers, this device offers ways to improve system output and maintain flexibility. With robust EMC performance – up to 4kV HBM – the A17700 also enables up to 30% fewer external components for a smaller total solution footprint, smaller PCB, and more cost-efficient system design.

“The A17700 allows system designers to easily select the optimal algorithm and I/O options that best fit their system requirements, balancing accuracy and end-of-line test times, thereby optimizing the system cost,” explains Haeyoung Choi, Product Manager for Sensor Interface ICs at Allegro. “With its small footprint and flexible compensation, the A17700 is the ideal solution for applications where space and efficiency matter, like in today’s electric and hybrid electric vehicles.”

The A17700 is available in a small form-factor 24-pin 4 mm × 4 mm QFN package with wettable flanks - ideal for ensuring reliable soldering and visual inspection of solder joints.

For more details on the A17700 please visit allegromicro.com/A17700.

Related

Allegro electronic components news resistive bridge pressure sensor sensor interface IC
Xilinx: Chip shortage has spread to other materials
Previous
IC Insights: TSMC Ranks in Top-10 For Capacity in Three Wafer Size Categories
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

Diodes rolls out USB-C PD3.1 dual-role controllers for high-power devices

January 19, 2026
0
Samsung to shut 8-inch S7 fab as mature-node wafer capacity tightens

Samsung to shut 8-inch S7 fab as mature-node wafer capacity tightens

January 19, 2026
0
Micron to buy PSMC fab facilities in $1.8 billion DRAM-linked deal

Micron to buy PSMC fab facilities in $1.8 billion DRAM-linked deal

January 19, 2026
0
TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

TDK rolls out ModCap UHP DC link capacitors for SiC-based high-power inverters

January 16, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator