ROHM Group's LAPIS Semiconductor develops the world's smallest wireless power supply control chipset "ML7630 (receiver/terminal)" and "ML7631 (transmitter/charger side)" for wearable devices.
The chipset is a wireless power supply control LSI that is suitable for wireless power supply of smart ear-mounted devices such as Bluetooth® headsets that have space limitations in wearable devices. In order to support applications in smart ear-worn devices, LAPIS Semiconductor miniaturizes the antenna (coil) by performing power transmission at a high frequency of 13.56 MHz, and integrates the functions required for charging into one chip. It is used as a SoC, which greatly reduces the installation space (50% compared to the area of the Micro USB connector). The wireless power supply of smart ear-worn devices, which was difficult to achieve in the past, now it not only contributes to the miniaturization of the devices, but also helps to improve the convenience, waterproofness, and dust-proofness of charging.
Even if the battery is exhausted, the receiver's “ML7630” can use the antenna magnetic field to generate electricity and start working. In addition, although it is a small WL-CSP package of only 2.6mm square, it achieves wireless power supply with output power up to 200mW. Furthermore, it also meets the NFC Forum Type3 Tag v1.0 standard and supports functions such as Bluetooth® pairing based on NFC. Moreover, the transmitter's “ML7631” can work with 5V power provided by USB power sources such as mobile phone batteries, which is very beneficial to the development of mobile chargers.
The chipset is expected to begin mass production in May 2018. The production of the previous process is the LAPIS Semiconductor Miyagi Factory, and the production process of the later stage "ML7630" is the LAPIS Semiconductor Miyazaki Factory.