SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › Manufacturer › Infineon receives two supply awards from DENSO
  • 0

Infineon receives two supply awards from DENSO

SemiMediaEdit
August 7, 2020

Infineon Technologies announced that it has received two supplier awards from Japanese automotive supplier DENSO.

Infineon is the first recipient of the “Special Contribution Award”. This award was established this year to recognize vendors showing excellent commitment to provide top-quality products that advance automotive innovation and meet the demands of the future of mobility while continuously providing premium service that transcends cultural differences.

Furthermore, the Infineon Americas team received the “North America Business Partner of the Year Award,” which is presented to a vendor delivering exceptional quality, performance, design support and partnership activities in the region. A total of 14 awards were presented during the 2020 North America Business Partner Convention which took place on July 22, 2020.

“We are honored to receive the two awards from DENSO, which are a testament to our global culture of premium service,” said Thomas Kaufmann, Vice President Automotive Operations and Member of the Automotive Board at Infineon. “Our system understanding, commitment to quality, and excellent support add value to our customers and help grow their business.”

According to DENSO, Infineon has greatly contributed to the improved competitiveness of DENSO’s electronic products as well as its appeal in the market by providing semiconductor products of the highest quality that directly connect with the product capacity of automobiles.

Related

Denso electronic components news Infineon
TDK launches failsafe chip varistors for automotive battery lines
Previous
Nexperia | The journey of Nexperia’s essential semiconductors
Next

All Comments (0)

Back
No Comment.

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung memory price hike to Apple highlights tight LPDDR5X supply

Samsung memory price hike to Apple highlights tight LPDDR5X supply

February 27, 2026
0
Hanwha report sees memory surge in 2026 as HBM gains traction

Hanwha report sees memory surge in 2026 as HBM gains traction

February 27, 2026
0
Broadcom targets 1 million stacked AI chips shipped by 2027

Broadcom targets 1 million stacked AI chips shipped by 2027

February 27, 2026
0
SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator