SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › NXP's automotive-grade chips will be manufactured using TSMC's 5nm process
  • 0

NXP's automotive-grade chips will be manufactured using TSMC's 5nm process

SemiMediaEdit
June 15, 2020

According to media reports, NXP's next-generation high-performance automotive-grade chips will be manufactured using TSMC's 5nm process. TSMC will deliver the first batch of 5nm process samples to NXP in 2021.

The main customers of TSMC's 5nm process are currently Apple and Hisilicon. However, due to the impact of the US ban on Huawei, analysts believe that TSMC's 5nm process may experience a decline in capacity utilization in the fourth quarter of this year.

TSMC said that it has already successfully cooperated with NXP in the 16nm process. After expanding the scope of cooperation, NXP's next-generation automotive processors will use TSMC's 5nm process to produce SoCs. NXP will provide products with multiple functions and workload requirements, including connected cockpit, high-performance domain controllers, autonomous driving, advanced networks, hybrid propulsion control, and integrated chassis management (integrated chassis management).

TSMC emphasizes that the 5nm process technology is currently the world's most advanced mass production process. Compared with the previous generation 7nm process, its speed is increased by about 20% and power consumption is reduced by about 40%.

Related

electronic components news NXP cooperate with TSMC
Qualcomm ranked first in the world's top ten IC design companies
Previous
Mitsubishi Electric acquires part of Sharp's Fukuyama semiconductor plant
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Arm reshapes business, creates physical AI unit to expand robotics and automotive push

Arm reshapes business, creates physical AI unit to expand robotics and automotive push

January 9, 2026
0
ASE may raise packaging prices by 5%–20%, above prior expectations

ASE may raise packaging prices by 5%–20%, above prior expectations

January 9, 2026
0
Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

January 8, 2026
0
TSMC weighs further Arizona expansion with fabs and advanced packaging

TSMC weighs further Arizona expansion with fabs and advanced packaging

January 8, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator