SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › Mitsubishi Electric acquires part of Sharp's Fukuyama semiconductor plant
  • 0

Mitsubishi Electric acquires part of Sharp's Fukuyama semiconductor plant

SemiMediaEdit
June 15, 2020

Mitsubishi Electric recently announced that it will acquire plants and land from Sharp's Fukuyama Semiconductor Co., Ltd. for producing power control ICs.

Mitsubishi Electric pointed out that in order to meet the rising demand for power control chips, the company has begun to look for new production bases a few months ago. At present, it has reached a consensus with Sharp on the acquisition of part of the land and plant of Fukuyama Branch. The estimated investment amount is about 20 billion yen (including the cost of acquiring land, plant, existing equipment and future equipment investment costs), and the new plant is scheduled to be opened in November 2021.

In addition, according to Japanese media reports, after Mitsubishi Electric acquired Sharp's above-mentioned factory, its overall power control IC production capacity will be doubled to the present.

Related

electronic components news Mitsubishi acquires Sharp Mitsubishi power control IC
NXP's automotive-grade chips will be manufactured using TSMC's 5nm process
Previous
TAIYO YUDEN Commercializes MLCCs with a Maximum Operating Temperature of 150°C
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
What is the root cause of the decline of the Japanese semiconductor industry?
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Arm reshapes business, creates physical AI unit to expand robotics and automotive push

Arm reshapes business, creates physical AI unit to expand robotics and automotive push

January 9, 2026
0
ASE may raise packaging prices by 5%–20%, above prior expectations

ASE may raise packaging prices by 5%–20%, above prior expectations

January 9, 2026
0
Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

Samsung, SK Hynix shift DRAM sales from long-term to quarterly contracts

January 8, 2026
0
TSMC weighs further Arizona expansion with fabs and advanced packaging

TSMC weighs further Arizona expansion with fabs and advanced packaging

January 8, 2026
0
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator