SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › KIOXIA's Fab 6 memory chip manufacturing facility caught fire
  • 0

KIOXIA's Fab 6 memory chip manufacturing facility caught fire

SemiMediaEdit
January 8, 2020

Yesterday, KIOXIA (formerly Toshiba Memory Corporation) issued a notice to customers that at 6:10 a.m. on January 7, 2020, a fire broke out at a manufacturing equipment at the company's Fab6 production plant in Yokkaichi, Mie Prefecture, Japan. The fire was quickly extinguished without causing casualties.

Manufacturing equipment at KIOXIA (formerly Toshiba) 's Fab 6 memory chip manufacturing facility catches fire

At present, the cause of the fire and the damage to the production equipment are still under investigation and statistics. KIOXIA said that if the fire affects the supply, the customer will be notified immediately.

The industry speculates that the fire occurred in the clean room of the factory, which may cause the clean room to malfunction in the short term, which may affect the supply and price of NAND Flash in the first quarter of this year.

On June 15, 2019, a 13-minute power outage occurred at KIOXIA's factory in Yokkaichi, Mie Prefecture, Japan. The power outage affected Fab2, Fab3, Fab4, Fab5, and Fab6 production facilities, which affected the supply of NAND Flash. In addition, on December 31, 2019, Samsung Electronics also experienced a brief power outage at its Hwaseong production facility, which resulted in the suspension of production of some NAND and DRAM production lines. With these accidents, the industry expects that the price of NAND Flash will rise further.

Related

DRAM market electronic components news KIOXIA factory caught fire Memory chip market NAND Flash Market
Samsung Foundry gets Qualcomm order
Previous
Murata and Google collaborate to develop the world's smallest AI module
Next

All Comments (0)

Back
No Comment.

Top Post

Fire broke out at AKM factory in Japan
Mouser Electronics expands to the Philippines with local customer service center
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
What is the root cause of the decline of the Japanese semiconductor industry?

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Hitachi weighs sale of storage business assets, including Hitachi Vantara

Hitachi weighs sale of storage business assets, including Hitachi Vantara

February 2, 2026
0
Tesla plans chip fab as it explores in-house semiconductor manufacturing

Tesla plans chip fab as it explores in-house semiconductor manufacturing

February 2, 2026
0
Vishay launches 1200V SiC MOSFET power modules for high-efficiency systems

Vishay launches 1200V SiC MOSFET power modules for high-efficiency systems

February 2, 2026
0
Allegro rolls out low-loss isolated current sensor for high-power systems

Allegro rolls out low-loss isolated current sensor for high-power systems

January 30, 2026
0
1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator