SemiMedia SemiMedia
  • Breaking News
  • MarketWatch
  • Distribution
  • Manufacturer
  • Video
  • About us
Home › MarketWatch › JCET announces acquisition of ADI's IC test facility in Singapore
  • 1

JCET announces acquisition of ADI's IC test facility in Singapore

SemiMediaEdit
December 26, 2019

On December 24, Chinese integrated circuit packaging and test service provider and discrete device manufacturer JCET Group announced that it will acquire ADI's semiconductor test plant in Singapore and will transfer ownership in May 2021. The acquisition is based on JCET Group and ADI's Strategic cooperation.

In response to this acquisition, JCET CEO Zheng Li said that ADI has always been a long-term customer that JCET attaches great importance to. This opportunity will not only expand JCET's testing site in Singapore, but more importantly, the signing of the strategic business agreement with ADI will create more cooperation opportunities for both parties. The new project investment in the Singapore plant also shows that JCET, as a multinational chip manufacturing company, will continue to steadily strengthen its global presence and provide first-class integrated circuit products and advanced technical services to international and local customers.

JCET has six factories in China, Singapore and South Korea. Its Singapore factory was established in 1994 and is one of the earliest IC packaging and test service providers in Singapore. Currently, JCET's revenue ranks third in the global integrated circuit packaging and testing industry.

Related

ADI Singapore electronic components news JCET
Cypress | Memory Solutions for 5G Wireless Infrastructure Applications
Previous
BusinessKorea: Samsung plans to reduce foundry service prices
Next

All Comments (1)

Back
  • David

    Jcet jia you

    6 yearsago

Top Post

Mouser Electronics expands to the Philippines with local customer service center
Fire broke out at AKM factory in Japan
Qualcomm ranked first in the world's top ten IC design companies
Analyze the key factors and prospects of electronic components shortage from the perspective of wafer industry
TSMC’s CoWoS capacity to reach 75,000 wafers/month by end-2025
onsemi expects to produce 200mm SiC wafers by 2025

Subscribe SemiMedia

Please check your E-mail to confirm the subscribtion.

Related posts

Samsung memory price hike to Apple highlights tight LPDDR5X supply

Samsung memory price hike to Apple highlights tight LPDDR5X supply

February 27, 2026
0
Hanwha report sees memory surge in 2026 as HBM gains traction

Hanwha report sees memory surge in 2026 as HBM gains traction

February 27, 2026
0
Broadcom targets 1 million stacked AI chips shipped by 2027

Broadcom targets 1 million stacked AI chips shipped by 2027

February 27, 2026
0
SK hynix, SanDisk launch HBF standard push for AI inference era

SK hynix, SanDisk launch HBF standard push for AI inference era

February 26, 2026
0
1 1
Copyright © 2017-2026 SemiMedia. Designed by nicetheme.
  • Please set up your first menu at [Admin -> Appearance -> Menus]
  • electronic components news
  • Electronic components supplier
  • Electronic parts supplier
  • Infineon
  • Electronic component news
  • Renesas
  • Vishay
  • STMicroelectronics
  • NXP
  • TDK

SemiMediaEdit

Administrator